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首页> 外文期刊>JOM >Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography
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Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography

机译：多尺度层析成像技术在锡焊中锡晶体和Cu6Sn5金属间化合物的三维表征

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摘要

Decreasing pitch size in electronic packaging has resulted in a drastic decrease in solder volumes. The Sn grain crystallography and fraction of intermetallic compounds (IMCs) in small-scale solder joints evolve much differently at the smaller length scales. A cross-sectional study limits the morphological analysis of microstructural features to two dimensions. This study utilizes serial sectioning technique in conjunction with electron backscatter diffraction to investigate the crystallographic orientation of both Sn grains and Cu6Sn5 IMCs in Cu/Pure Sn/Cu solder joints in three dimensional (3D). Quantification of grain aspect ratio is affected by local cooling rate differences within the solder volume. Backscatter electron imaging and focused ion beam serial sectioning enabled the visualization of morphology of both nanosized Cu6Sn5 IMCs and the hollow hexagonal morphology type Cu6Sn5 IMCs in 3D. Quantification and visualization of microstructural features in 3D thus enable us to better understand the microstructure and deformation mechanics within these small scale solder joints.
机译：电子封装中间距尺寸的减小导致焊料量的急剧减少。小型焊点中的Sn晶粒结晶学和金属间化合物（IMC）的比例在较小的长度尺度上变化很大。横断面研究将微观结构特征的形态分析限制为二维。这项研究利用连续切片技术结合电子背散射衍射技术，以三维（3D）方式研究了铜/纯锡/铜焊点中锡晶粒和Cu6Sn5 IMC的晶体学取向。晶粒长宽比的量化受焊料体积内局部冷却速率差异的影响。背向散射电子成像和聚焦离子束连续切片使3D纳米Cu6Sn5 IMC和空心六边形Cu6Sn5 IMC形态的可视化成为可能。因此，3D中微观结构特征的量化和可视化使我们能够更好地了解这些小型焊点中的微观结构和变形机制。

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