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首页> 外文期刊>Journal of Micromechanics and Microengineering >Profile control of a borosilicate-glass groove formed by deep reactive ion etching
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Profile control of a borosilicate-glass groove formed by deep reactive ion etching

机译：通过深反应离子刻蚀形成的硼硅酸盐玻璃凹槽的轮廓控制

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摘要

We investigated the deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove. We carried out DRIE using an anodically bonded silicon wafer as an etching mask. We controlled the glass-groove profile, namely improving its sidewall angle, by removing an excessive polymer film produced by carbon-fluoride etching gases during DRIE. We experimentally compared two fabrication processes for effective removal of the polymer film: (1) DRIE with the addition of argon (Ar) to the etching gases and (2) a novel combined process in which DRIE and subsequent ultrasonic cleaning in DI water were alternately carried out. Both processes improved the sidewall angle, reaching 85° independent of the mask-opening width. The results showed that the processes remove the excessive polymer film on sidewalls. Accordingly, the processes are an effective way to control the groove profile of borosilicate glass.
机译：我们研究了硼硅玻璃的深反应离子蚀刻（DRIE）和蚀刻槽的轮廓控制。我们使用阳极键合的硅片作为蚀刻掩模进行了DRIE。我们通过去除在DRIE过程中由氟化碳蚀刻气体产生的过多聚合物膜，来控制玻璃凹槽轮廓，即改善其侧壁角度。我们通过实验比较了两种可有效去除聚合物膜的制造工艺：（1）在蚀刻气体中添加氩（Ar）的DRIE;（2）交替使用DRIE和随后在去离子水中进行超声波清洗的新型组合工艺执行。两种工艺均改善了侧壁角度，与掩模开口宽度无关地达到了85°。结果表明，该工艺去除了侧壁上多余的聚合物膜。因此，该方法是控制硼硅酸盐玻璃的凹槽轮廓的有效方法。

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