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Mechanisms for the millisecond laser-induced functional damage to silicon charge-coupled imaging sensors

机译：毫秒激光引起的对硅电荷耦合成像传感器的功能损害的机制

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A three-dimensional model was established to simulate the process of a millisecond Nd: YAG laser irradiating the CCD, based on its array and multilayer structure. The transient temperature and thermal stress field of the CCD were calculated by using the finite element method. The temperature dependence of material parameters was taken into consideration in the calculation. The results indicated that coupling of the heat damage and thermal stress damage was the main reason for the millisecond laser damage CCD. Softening of the PMMA microlens or rupture of the silica microlens reduced the fill factor of the CCD. Plastic deformation of the silicon substrate increased a great deal of dark current. The leakage current was introduced due to the peeled Al shield. Most importantly, the melting through of the Al-shield layer and the fracture of the silica insulating layer are the two critical factors for functional damage to the CCD. Meanwhile, the influence of the material and fill factor of the microlens was also considered. The results showed that plastic damage of the silicon substrate was more dramatic than the PMMA microlens CCD. And the damage threshold decreased along with the increasing fill factor. (C) 2015 Optical Society of America
机译：建立了三维模型，以其阵列和多层结构为基础，模拟了Nd：YAG激光照射CCD的过程。采用有限元法计算了CCD的瞬态温度和热应力场。计算中考虑了材料参数的温度依赖性。结果表明，热损伤和热应力损伤的耦合是毫秒级激光损伤CCD的主要原因。 PMMA微透镜的软化或二氧化硅微透镜的破裂降低了CCD的填充系数。硅基板的塑性变形增加了大量的暗电流。由于剥离的铝屏蔽层而引入了泄漏电流。最重要的是，铝屏蔽层的熔化和二氧化硅绝缘层的破裂是造成CCD功能损坏的两个关键因素。同时，还考虑了微透镜的材料和填充因子的影响。结果表明，与PMMA微透镜CCD相比，硅衬底的塑性损伤更为严重。损伤阈值随填充因子的增加而降低。 （C）2015年美国眼镜学会

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