Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers

Zhao Zhigang; Guo Jinchuan; Lei Yaohu; Niu Hanben

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Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers

机译：全5英寸硅晶片上的均匀大孔阵列的光电化学蚀刻

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We analyze the two main factors causing non-uniformity of the etched macropore array first, and then a novel photoelectrochemical etching setup for large area silicon wafers is described. This etching setup refined typical etching setups by a water cooling system and a shower-head shaped electrolyte circulator. Experimental results showed that the uniform macropore array on full 5-inch n-type silicon wafers could be fabricated by this etching setup. The morphology of the macropore array can be controlled by adjusting the corresponding etching parameters.

机译：我们分析了引起蚀刻大孔阵列的不均匀性的两个主要因素，然后描述了用于大面积硅晶片的新型光电化学蚀刻设置。该蚀刻设置通过水冷系统和淋浴头形电解质循环器精制典型的蚀刻设置。实验结果表明，通过该蚀刻设置可以制造全5英寸N型硅晶片上的均匀大孔阵列。可以通过调整相应的蚀刻参数来控制Macropore阵列的形态。

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来源
《Journal of Semiconductors》 |2010年第7期|共5页
作者
Zhao Zhigang; Guo Jinchuan; Lei Yaohu; Niu Hanben;
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作者单位

Institute of Optoelectronics Engineering Shenzhen University Shenzhen 518060 China;

Institute of Optoelectronics Engineering Shenzhen University Shenzhen 518060 China;

Institute of Optoelectronics Engineering Shenzhen University Shenzhen 518060 China;

Institute of Optoelectronics Engineering Shenzhen University Shenzhen 518060 China;

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原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词
photoelectrochemical etching; macropore array; large area; non-uniformity; current density;

机译：光电化学蚀刻;大孔阵;大面积;不均匀;电流密度;

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专利

1. Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers [J] . Zhao Zhigang, Guo Jinchuan, Lei Yaohu, Journal of Semiconductors . 2010,第7期

机译：全5英寸硅晶片上的均匀大孔阵列的光电化学蚀刻
2. Black silicon with controllable macropore array for enhanced photoelectrochemical performance [J] . Ao Xianyu, Tong Xili, Sik Kim Dong, Applied Physics Letters . 2012,第11期

机译：黑硅具有可控的大孔阵列，可增强光电化学性能
3. Black silicon with controllable macropore array for enhanced photoelectrochemical performance [J] . Xianyu Ao, Xili Tong, Dong Sik Kim, Applied Physics Letters . 2012,第11期

机译：黑硅具有可控的大孔阵列，可增强光电化学性能
4. Electrochemical Etching of Deep Macropore Array on p-Type Silicon Wafers [C] . Yanjun Gao, Guozheng wang, Qingduo Duanmu, MEMS/MOEMS Technologies and Applications II . 2004

机译：p型硅晶片上的深大孔阵列的电化学刻蚀
5. Electrical through-wafer interconnects and microfabricated cantilever arrays using through-wafer silicon etching. [D] . Chow, Eugene Michael. 2001

机译：晶圆上电互连和使用晶圆硅刻蚀的微型悬臂阵列。
6. Improvement of polycrystalline silicon wafer solar cell efficiency by forming nanoscale pyramids on wafer surface using a self-mask etching technique [O] . Hsin-Han Lin, Wen-Hwa Chen, Franklin C.-N. Hong -1

机译：通过使用自掩膜蚀刻技术在晶圆表面形成纳米级金字塔提高多晶硅晶圆太阳能电池效率
7. WET ETCHING UNIFORM WAFER-LEVEL THINNING OF BULK PIEZOELECTRIC CERAMICS ON SILICON [O] . E.E. Aktakka, R.L. Peterson, K. Najafi 2012

机译：硅片压电陶瓷湿蚀刻和均匀晶片级变薄

Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers

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