Microfabrication of 3D silicon MEMS structures using gray-scale lithography and deep reactive ion etching

Waits CM; Morgan B; Kastantin M; Ghodssi R

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Microfabrication of 3D silicon MEMS structures using gray-scale lithography and deep reactive ion etching

机译：使用灰度光刻和深度反应离子刻蚀对3D硅MEMS结构进行微加工

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Micromachinina arbitrary 3D silicon structures for micro-electromechanical systems can be accomplished using gray-scale lithography along with dry anisotropic etching. In this study, we have investigated the use of deep reactive ion etching (DRIE) and the tailoring of etch selectivity for precise fabrication. Silicon loading, the introduction of an O-2 step, wafer electrode power, and wafer temperature are evaluated and determined to be effective for coarsely controlling etch selectivity in DRIE. The non-uniformity and surface roughness characteristics are evaluated and found to be scaled by the etch selectivity when the 3D profile is transferred into the silicon. A micro-compressor is demonstrated using gray-scale lithography and DRIE showing that etch selectivity can be successfully tailored for a specific application. (c) 2004 Elsevier B.V. All rights reserved.

机译：可以使用灰度光刻以及干法各向异性蚀刻来完成用于微机电系统的微机械加工任意3D硅结构。在这项研究中，我们研究了深度反应离子刻蚀（DRIE）的使用和精确刻蚀的刻蚀选择性定制。评估并确定硅负载量，O-2步骤的引入，晶片电极功率和晶片温度对于有效地粗略控制DRIE中的蚀刻选择性是有效的。当将3D轮廓转移到硅中时，可以评估非均匀性和表面粗糙度特性，并根据蚀刻选择性对其进行缩放。使用灰度光刻和DRIE演示了一种微型压缩机，表明可以针对特定应用成功定制蚀刻选择性。（c）2004 Elsevier B.V.保留所有权利。

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《Sensors and Actuators, A. Physical》 |2005年第1期|共9页
作者
Waits CM; Morgan B; Kastantin M; Ghodssi R;
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正文语种 eng
中图分类自动化元件、部件;
关键词
gray-scale lithogaphy; DRIE; MEMS; etch selectivity; DIFFRACTIVE-OPTICS FABRICATION; TONE MASK;

机译：灰度石印术;DRIE;MEMS;刻蚀选择性;衍射光学结构;色泽;

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1. Microfabrication of 3D silicon MEMS structures using gray-scale lithography and deep reactive ion etching [J] . Waits CM, Morgan B, Kastantin M, Sensors and Actuators, A. Physical . 2005,第1期

机译：使用灰度光刻和深度反应离子刻蚀对3D硅MEMS结构进行微加工
2. Large-scale Patterning of Hydrophobic Silicon Nanostructure Arrays Fabricated by Dual Lithography and Deep Reactive Ion Etching [J] . Zhibo Ma, Chengyu Jiang, Weizheng Yuan, Nano-Micro Letters . 2013,第1期

机译：双光刻和深反应离子刻蚀制备的疏水性硅纳米结构阵列的大规模图案化
3. Large-scale Patterning of Hydrophobic Silicon Nanostructure Arrays Fabricated by Dual Lithography and Deep Reactive Ion Etching [J] . Zhibo Ma, Chengyu Jiang, Weizheng Yuan, 纳微快报：英文版 . 2013,第001期

机译：双光刻和深反应离子刻蚀制备的疏水性硅纳米结构阵列的大规模图案化
4. ADVANCED SILICON ETCHING TECHNIQUES BASED ON DEEP REACTIVE ION ETCHING (DRIE) FOR SILICON HARMS AND 3D MICRO- AND NANO-STRUCTURES [C] . F.Marty, L.Rousseau, B.Saadany, Conference on European Micro and Nano Systems(EMN04): First Issue Advances amp; Applications for Micro amp; Nano Systems; 20041020-21; Paris(FR) . 2004

机译：基于深度反应离子刻蚀（DRIE）的先进硅刻蚀技术，用于硅损伤以及3D微观和纳米结构
5. Development of a deep silicon phase Fresnel lens using gray-scale lithography and deep reactive ion etching [D] . Morgan, Brian C. 2004

机译：使用灰度光刻和深反应离子刻蚀开发深硅相菲涅耳透镜
6. Formation of silicon nanostructures with a combination of spacer technology and deep reactive ion etching [O] . Daniel CS Bien, Hing Wah Lee, Siti Aishah Mohamad Badaruddin 2012

机译：结合隔离技术和深反应离子刻蚀形成硅纳米结构
7. Development of a Deep Silicon Phase Fresnel Lens using Gray-scale Lithography and Deep Reactive Ion Etching [O] . Morgan, Brian 2004

机译：使用灰度光刻和深反应离子刻蚀技术开发深硅相菲涅尔透镜
8. New Deep Reactive Ion Etching Process Developed for the Microfabrication of Silicon Carbide [R] . Evans, Laura J., Beheim, Glenn M. 2005

机译：新型深反应离子蚀刻工艺开发用于碳化硅微加工

Microfabrication of 3D silicon MEMS structures using gray-scale lithography and deep reactive ion etching

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