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MACRO INSPECTION METHOD FOR WAFER AND AUTOMATIC WAFER MACRO INSPECTION DEVICE

机译：晶片的宏检测方法和自动晶片宏检测装置

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摘要

PROBLEM TO BE SOLVED: To automatically perform an appearance inspection of a pattern formed on a wafer.;SOLUTION: The automatic wafer macro inspection device used for the appearance inspection of the pattern formed on the surface of the wafer comprises an image detection part 16 detecting a surface image of the wafer to be inspected and a surface image of a reference wafer as an image to be inspected and a reference image, respectively; and an image processing part 18 mutually comparing the detected reference image and image to be inspected, and determining the propriety of the wafer to be inspected according to the result of comparison. The image detection part 16 comprises a coat/development failure inspection part 12 inspecting the pattern for coat failure and development failure.;COPYRIGHT: (C)2005,JPO&NCIPI

机译：解决的问题：自动对晶片上形成的图案进行外观检查。解决方案：用于对晶片表面上形成的图案进行外观检查的自动晶片宏检查装置包括图像检测部16，该图像检测部16进行检测。被检查晶片的表面图像和作为检查对象图像的参考晶片的表面图像分别为参考图像;图像处理部18将检测出的基准图像与检查对象图像相互比较，并根据比较结果来确定检查对象晶片的适当性。图像检测部分16包括检查涂布失败和显影失败的图案的涂布/显影失败检查部分12。版权所有：（C）2005，JPO＆NCIPI

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公开/公告号JP2005214980A

专利类型
公开/公告日2005-08-11

原文格式PDF
申请/专利权人 MIYAZAKI OKI ELECTRIC CO LTD;OKI ELECTRIC IND CO LTD;
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申请/专利号JP20050022991
发明设计人 YOSHITAKA NAOTO;
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申请日2005-01-31
分类号G01N21/956;G01B11/24;G01B11/30;G06T1/00;H01L21/027;
国家 JP
入库时间 2022-08-21 22:37:07

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