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Wafer of macro inspection method and automatic wafer macro inspection equipment
Wafer of macro inspection method and automatic wafer macro inspection equipment
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机译：晶圆宏观检测方法及自动晶圆宏观检测设备
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摘要
PROBLEM TO BE SOLVED: To automatically inspect a pattern formed on the surface of a wafer, by detecting the surface image of the wafer, comparing the pattern of the surface image with the pattern of a reference picture, and judging the state of the pattern in accordance with the compared result. ;SOLUTION: The reference picture detected in a picture detection part 10 is stored in a reference picture memory 48 of a picture storage part 36. A picture to be inspected, which is detected in the picture detection part 10, is stored in a detection picture memory 46. The reference picture and the inspected picture are read from the picture storage part 36 and they are compared by a comparison means 38. The output of the comparison means 38 is sent to a judgment means 40 and the propriety of the wafer is judged in accordance with the output of the comparison means 38. The output of the judgment means 40 is sent to a display means 42 and the judged result is displayed. Thus, visual inspection is eliminated, the judgment reference of the propriety of the pattern generated on the surface of the wafer becomes constant and inspection can efficiently be executed.;COPYRIGHT: (C)1998,JPO
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