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首页> 外文会议>2016 IEEE 37th International Electronics Manufacturing Technology amp; 18th Electronics Materials and Packaging Conference >Redefining IC packages with super-thin Substrates
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Redefining IC packages with super-thin Substrates

机译：用超薄基板重新定义IC封装

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摘要

In an industry which demands for continuous innovation and perfection, we are constantly deriving new processes and solutions to break the technological limits which will set us apart. We are striving to achieve denser integrated circuits for better performance as Moore's law perceives and also redefining the word, “Thin”. Driven by cost and in order to achieve thinner IC packages, we have created an innovative solution which enables us to produce ultra-thin substrates. This technology allows us to make use of conventional materials such as PICs(photo imagable coverlay) and merging them with substrates to create products as thin as 25um. Our aim is to showcase the advantages of our Super-thin substrates versus the Molded interconnect substrates in terms of process and capability. This project is done and carried out in QDOS Interconnect.
机译：在一个需要不断创新和完善的行业中，我们不断开发出新的工艺和解决方案来突破技术极限，这将使我们与众不同。我们正在努力实现密度更高的集成电路，以提高摩尔定律的性能，并重新定义“薄”一词。在成本的驱动下，为了实现更薄的IC封装，我们创造了一种创新的解决方案，使我们能够生产超薄基板。这项技术使我们能够利用诸如PICs（可成像覆盖层）之类的常规材料，并将它们与基材融合在一起，以生产出厚度仅为25um的产品。我们的目的是展示就工艺和功能而言，超薄基板与模塑互连基板相比的优势。该项目在QDOS互连中完成并执行。

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