首页> 外文会议>2017 32nd Symposium on Microelectronics Technology and Devices >Study of the phase transitions of Nickel Platinum Silicide obtained by sputtering and rapid thermal processing
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Study of the phase transitions of Nickel Platinum Silicide obtained by sputtering and rapid thermal processing

机译:溅射和快速热处理获得的镍硅化镍铂的相变研究

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Nickel-Platinum Silicide (NiPtSi) layers were formed using a Rapid Thermal Process (RTP) furnace. The metal thin films were deposited by RF Magnetron Sputtering using a Ni(Pt) target (97% Ni and 3% Pt) onto a Si (100) substrate. The silicidation of the samples were performed at temperature ranged from 450°C to 900°C. Energy Dispersion Scanning (EDS) and Grazing Incidence X-Ray Diffraction (GIXRD) were used to confirm the composition and phase of the NiPtSi for each rapid thermal process (RTP) temperature. The Scanning Electron Microscopy was also used to evaluate the surface and difference for each temperature. The lower resistivity monosilicide phase is predominant at temperatures lower than 850°C.
机译:使用快速热处理(RTP)炉形成了镍铂硅化物(NiPtSi)层。通过使用Ni(Pt)靶材(97%Ni和3%Pt)进行RF磁控溅射将金属薄膜沉积到Si(100)衬底上。样品的硅化在450℃至900℃的温度范围内进行。使用能量分散扫描(EDS)和掠入射X射线衍射(GIXRD)来确定每个快速热处理(RTP)温度下NiPtSi的成分和相。扫描电子显微镜还用于评估每个温度的表面和差异。在低于850°C的温度下,较低电阻率的单硅化物相占主导地位。

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