Via fill and intervia converage of AR5 and AR7 anti-reflectants were measured for 608nm deep vias in thermal oxide. Fitting functions were found which gave good agreement with experimental data (Rsq generally over 0.87). The most important factors were AR thickness, via duty ratio and via width. The importance of these factors was different for via fill and intervia converage, and for AR5 and AR7. AR7 was found to fill a range of vias (sizes from 200nm to 350nm, and pitches from 1:1 to semi-isolated) to a depth of 25
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