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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loadings
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Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loadings

机译：跌落冲击载荷下应变率效应对焊点性能的影响

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摘要

The strain rate dependent Johnson-Cook material model and the rate independent elastic-plastic model of lead-free solders were used to investigate influence of strain rate effect on the mechanical behavior of solder joints under drop impact loadings. Failure of the solder joints was predicted and the results were compared with the experimental observations. The strain rate effect of lead-free solders has no influence on the deflection of the PCB during the drop impact but has significant influence on the stress and strain in solder joints. The rate independent elastic-plastic solder material model always underestimates the stress and overestimates the strain of the solder joint. The material model that takes the strain rate effect into account can predict more realistic behavior of the solder joints.
机译：使用应变速率依赖的Johnson-Cook材料模型和无速率焊料的速率无关的弹塑性模型来研究在下落冲击载荷下应变速率效应对焊点机械性能的影响。可以预测焊点的失效，并将结果与​​实验结果进行比较。无铅焊料的应变率效应对跌落冲击过程中的PCB挠度没有影响，但对焊点中的应力和应变影响很大。与速率无关的弹塑性焊料材料模型总是低估了应力，而高估了焊点的应变。考虑了应变率效应的材料模型可以预测焊点的更实际行为。

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  • 来源
  • 会议地点 Beijing(CN)
  • 作者

    Tong AN; Fei QIN; Jiangang Li;

  • 作者单位

    College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology, Beijing, 100124, China;

    College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology, Beijing, 100124, China;

    College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 包装工程;
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