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首页> 外文会议>Fracture and strength of solids VII >Investigation of the Correlation between IC Chip Pick-up Performance and Peeling Behavior of Adhesive Tapes
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Investigation of the Correlation between IC Chip Pick-up Performance and Peeling Behavior of Adhesive Tapes

机译：IC芯片拾取性能与胶带剥离性能之间的相关性研究

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摘要

It was investigated that the influences of the peeling behavior of adhesive tapes in peeling tests on IC chip pick-up performance. Needles peel off an IC chip with an adhesive film from the base material in the pick-up process, by sticking out the backside of the base material. In the case that the peeling forces of the adhesive tape decrease as the peeling speeds increase in peeling tests, only two kinds of behaviors were observed in pick-up test; the peeling propagated little and the IC chip was not peeled off under critical needle displacement while the pick-up was completed instantaneously over critical needle displacement. In the case that the peeling forces of the adhesive tape increase as the peeling speeds increase, the pick-up time decreased as the needle displacement increased. As a result, it can be concluded that the needle displacement where the peeling propagates instantaneously is critical for succeeded pick-up if the peeling forces of the adhesive tape decrease as the peeling speeds increase. If the peeling forces of the adhesive tape increase as the peeling speeds increase, the information of peeling speeds at each needle displacement are needed to estimate how long it takes to pick-up a chip.
机译：研究了在剥离测试中胶带的剥离行为对IC芯片拾取性能的影响。在拾取过程中，通过将基材的背面伸出，针头会用粘合剂膜从基材上剥离IC芯片。在剥离试验中，胶带的剥离力随着剥离速度的增加而降低的情况下，在拾取试验中仅观察到两种行为。在临界针位移下，剥离几乎没有扩散，并且在临界针位移以上瞬间完成了拾取，IC芯片没有被剥离。在胶带的剥离力随着剥离速度的增加而增加的情况下，拾取时间随着针头位移的增加而减少。结果，可以得出结论，如果胶带的剥离力随着剥离速度的增加而减小，则剥离在瞬间传播的针位移对于成功的拾取至关重要。如果胶带的剥离力随着剥离速度的增加而增加，则需要每个针位移处的剥离速度的信息来估计拾起芯片需要多长时间。

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