首页> 外文会议>International Symposium on High Dielectric Constant and Other Dielectric Materials for Nanoelectronics and Photonice >The NH_3 nitridation effects on a Al_2O_3 passivation by atomic layer deposition (ALD) in the HfO_2/GaAs systems
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The NH_3 nitridation effects on a Al_2O_3 passivation by atomic layer deposition (ALD) in the HfO_2/GaAs systems

机译:HFO_2 / GaAs系统中原子层沉积(ALD)对AL_2O_3钝化的NH_3氮化效应

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We investigated the nitridation effects on a passivating Al_2O_3 layer formed by atomic layer deposition (ALD) process at the interface of HfO_2/GaAs. Results reveal that formation of Ga-O is suppressed greatly when annealed under NH_3 ambient for the HfO_2/GaAs system. Moreover if the Al_2O_3 layer is thick enough, diffusion of Ga into the high-k dielectric is blocked effectively, even after heat treatment at 500°C. Results of chemical analyses by x-ray photoelectron spectroscopy (XPS) and micro-structure analyses by high-resolution transmission electron microscopy (HR-TEM) are presented.
机译:我们研究了通过HFO_2 / GaAs的界面处由原子层沉积(ALD)工艺形成的钝化Al_2O_3层。结果表明,当HFO_2 / GaAs系统的NH_3环境下退火时,大大抑制了GA-O的形成。另外,如果Al_2O_3层足够厚,即使在500℃下热处理,也会有效地阻挡Ga进入高k电介质的扩散。提出了通过高分辨率透射电子显微镜(HR-TEM)的X射线光电子能谱(XPS)和微结构分析的化学分析结果。

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