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首页> 外文会议>Conference on Micromachining and Microfabrication Process Technology >Enhancing filling of interconnect deep trenches using forced convection magneto-electroplating
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Enhancing filling of interconnect deep trenches using forced convection magneto-electroplating

机译：使用强制对流磁电镀增强互连深沟的填充

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Filling deep trenches and cavities is currently accomplished by copper electro-less plating technology utilizing super-conformal deposition methods. Unlike typical electrolyses processes, where an electric potential is applied between the anodes to activate the plating reaction, electro-less plating relies on chemical agents to activate deposition. To achieve super-conformal deposition, special electrolytic paths must be used. This poses a challenge to the fabrication of narrower trenches, and thus requires the development of other deposition schemes. This work proposes an alternative solution to the filling of deep trenches that avoids the difficulties outlined above, using a forced convection magneto-electroplating method. The technique operates as in typical electrolysis processes, however, with forcing the flow of the plating electrolyte, by hydro-dynamic means, in the presence of an externally applied magnetic field. This arrangement introduces a Lorentz type of force that enhances the transport of deposit species toward desired locations, such as deep regions in interconnect trenches. The proposed method is demonstrated by filling interconnect trenches with aspect ratio as high as 3:1. Quality of samples filled using the proposed magneto-electroplating method is compared with the quality of samples filled by typical electroplating method.
机译：利用超成形沉积方法，目前通过铜电子电镀技术实现填充深沟和腔。与典型的电解过程不同，其中在阳极之间施加电势以激活电镀反应，电镀粘附依赖于化学试剂以活化沉积。为了实现超成形沉积，必须使用特殊的电解路径。这对较窄的沟槽制造具有挑战，因此需要开发其他沉积方案。这项工作提出了一种替代解决方案来填充深沟沟槽，其使用强制对流磁电镀方法避免上述困难。然而，该技术在典型的电解过程中运行，在外部施加的磁场存在下，通过氢动力学装置强制电镀电解质的流动。这种布置介绍了一种洛伦兹类型的力，其增强了沉积物物种对所需位置的运输，例如互连沟槽中的深层区域。通过将梯度比填充高达3：1的梯度沟槽填充互连沟槽来证明所提出的方法。使用所提出的磁电镀方法填充的样品的质量与典型电镀方法填充的样品的质量进行比较。

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