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Enhancing filling of interconnect deep trenches using Forced convection magneto-electroplating

机译：使用强制对流磁电镀增强互连深沟槽的填充

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Filling deep trenches and cavities is currently accomplished by copper electro-less plating technology utilizing super-conformal deposition methods. Unlike typical electrolyses processes, where an electric potential is applied between the anodes to activate the plating reaction, electro-less plating relies on chemical agents to activate deposition. To achieve super-conformal deposition, special electrolytic paths must be used. This poses a challenge to the fabrication of narrower trenches, and thus requires the development of other deposition schemes. This work proposes an alternative solution to the filling of deep trenches that avoids the difficulties outlined above, using a forced convection magneto-electroplating method. The technique operates as in typical electrolysis processes, however, with forcing the flow of the plating electrolyte, by hydro-dynamic means, in the presence of an externally applied magnetic field. This arrangement introduces a Lorentz type of force that enhances the transport of deposit species toward desired locations, such as deep regions in interconnect trenches. The proposed method is demonstrated by filling interconnect trenches with aspect ratio as high as 3:1. Quality of samples filled using the proposed magneto-electroplating method is compared with the quality of samples filled by typical electroplating method.
机译：当前，通过利用超保形沉积方法的化学镀铜技术来完成深沟槽和空腔的填充。与通常在阳极之间施加电势以激活电镀反应的典型电解工艺不同，无电电镀依靠化学试剂来激活沉积。为了实现超保形沉积，必须使用特殊的电解路径。这对窄沟槽的制造提出了挑战，因此需要开发其他沉积方案。这项工作提出了一种替代方法，可以使用强制对流磁电镀方法来避免深沟槽的出现，从而避免了上述困难。然而，该技术如在典型的电解过程中一样操作，但是在存在外部施加的磁场的情况下，通过流体动力学手段迫使电镀电解液流动。这种布置引入了洛伦兹（Lorentz）型力，该力增强了沉积物向所需位置（例如互连沟槽中的深部区域）的传输。通过以3：1的纵横比填充互连沟槽来证明所提出的方法。将使用建议的电磁电镀方法填充的样品的质量与通过典型电镀方法填充的样品的质量进行比较。

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