Impact of Mold Properties on the Reliability of Ball Grid Array Packaging

机译：模具性能对球栅阵列包装可靠性的影响

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A fatigue model based on viscoplastic material properties and accumulated plastic work was applied to predict crack initiation and crack propagation on Pb-free solder joints. The fatigue model relies on finite element analysis of Ball Grid array electronic packages and Design of Experiments methodology to explore the impact of mold material properties and thickness on the package reliability. It was observed that the outermost solder joint has the lowest failure free life in agreement with the literature.

机译：基于粘塑性材料特性和累积塑性功的疲劳模型用于预测无铅焊点上的裂纹萌生和裂纹扩展。疲劳模型依赖于球栅阵列电子封装的有限元分析和实验设计方法，以探索模具材料性能和厚度对封装可靠性的影响。据观察，与文献一致，最外面的焊点具有最低的无故障寿命。

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来源
《Microelectronics technology and devices - SBMicro 2011》|2011年|p.447-454|共8页
会议地点 Joao Pessoa(BR);Joao Pessoa(BR)
作者
Enio L. Carpi; Talita Mazon;
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作者单位

Divisao de Microssistemas e Empacotamento, Centro de Tecnologia da Informacao Renato Archer, Campinas Brazil;

Divisao de Microssistemas e Empacotamento, Centro de Tecnologia da Informacao Renato Archer, Campinas Brazil;

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原文格式 PDF
正文语种 eng
中图分类半导体技术;
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2. FEM simulation of the reliability of Ball Grid Array packages under drop impact conditions: Modeling intermetallic compound fracture using the cohesive zone model [J] . G. L. Tsebo Simo, H. Shirangi, M. Nowottnick, DVS-Berichte . 2014,第301期

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3. Impact of Electrical Current on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects [J] . TAE-KYU LEE Journal of Electronic Materials . 2013,第4期

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4. Impact of Mold Properties on the Reliability of Ball Grid Array Packaging [C] . Enio L. Carpi, Talita Mazon Symposium on Microelectronics Technology and Devices . 2011

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5. Temperature cycling reliability of reballed and reworked ball grid array packages in tin-lead and SAC assembly. [D] . Nie, Lei. 2010

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6. Fabrication of a Micro-Lens Array Mold by Micro Ball End-Milling and Its Hot Embossing [O] . Peng Gao, Zhiqiang Liang, Xibin Wang, 2018

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7. A Design Method for Estimating the Reliability of Lead Free Solder Joints in Ball-Grid-Array-Type Packages under Impact Load [O] . Akihiro YAGUCHI, Munehiro YAMADA, Kenichi YAMAMOTO 2003

机译：抗冲击载荷下球栅阵列型包装中无铅焊点可靠性的设计方法

Impact of Mold Properties on the Reliability of Ball Grid Array Packaging

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