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首页> 外文会议>Nanotechnology III; Proceedings of SPIE-The International Society for Optical Engineering; vol.6591 >Mechanical Dynamical Analysis of ultra thin resist films for microlithography applications
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Mechanical Dynamical Analysis of ultra thin resist films for microlithography applications

机译：用于微光刻的超薄抗蚀剂膜的机械动力学分析

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In this paper we investigate an in situ measurement of polymer and lithographic resist film mechanical properties on a silicon substrate, with a Dynamical Mechanical Analysis tool (DMA). This technique allows the measure of the glass transition temperature (Tg) of the resist film (thickness range: several μm to few nm) and its elastic and viscous modulus variations with a high precision and reproducibility. Indeed, DMA appears to be more sensitive than other thermal analysis methods like Differential Scanning Calorimetry (DSC), to monitor Tg variations induced by film thickness reduction. First we will discuss the performance of the tool and present the variations of the glass transition temperature of a PMMA (PolyMethylMethAcrylate) layer as a function of its thickness: we observe a shift towards higher temperatures up to 30℃ when the film thickness decreases from one micrometer to 10nm. This behavior highlights the importance of surface properties versus bulk. We will also discuss the interest of the DMA technique applied to more complex chemistries, as it is the case for lithographic resist formulations, i.e. a blend of polymer with grafted functionalities, photoactive compounds and various additives. We successfully applied this technique to characterize different resist film thicknesses and we observed the effect of the thickness on the thermal events. Such kind of change is important to take into account in the optimization of material performance for thin film applications. This material understanding allows to better define the process conditions and can be applied to different microelectronic topics such as: thermal flow treatment of positive tone photo resists, hot-embossing nanoimprint, cross linking reactions with negative tone resists or so called "hardening" processes.
机译：在本文中，我们研究了使用动态力学分析工具（DMA）在硅衬底上原位测量聚合物和光刻胶膜的机械性能。该技术可以高精度和可重复性地测量抗蚀剂膜的玻璃化转变温度（Tg）（厚度范围：几微米至几纳米）及其弹性和粘性模量变化。确实，DMA似乎比其他热分析方法（例如差示扫描量热法（DSC））更灵敏，可以监测由薄膜厚度减少引起的Tg变化。首先，我们将讨论该工具的性能，并介绍PMMA（聚甲基丙烯酸甲酯）层的玻璃化转变温度随其厚度的变化：当膜厚度从1降低到30℃时，我们观察到温度会升高。微米至10nm。这种行为凸显了表面性质与体积的重要性。我们还将讨论应用于更复杂化学的DMA技术的兴趣，因为平版印刷抗蚀剂配方就是这种情况，即具有接枝官能团的聚合物，光活性化合物和各种添加剂的混合物。我们成功地将该技术用于表征不同的抗蚀剂膜厚度，并观察了厚度对热事件的影响。在优化薄膜应用的材料性能时，必须考虑到这种变化。这种材料上的理解可以更好地定义工艺条件，并可以应用于不同的微电子主题，例如：正型光刻胶的热流处理，热压印纳米压印，与负型光刻胶的交联反应或所谓的“硬化”工艺。

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