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Investigation of Fundamental Properties of Nanoscale Cu/Sn Diffusion Couples

机译：纳米级Cu / Sn扩散对基本性质的研究

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摘要

By choosing two-segment Cu-Sn nanowires as a model system in which Sn acts as the solder element and Cu serves as a functional element, we seek to elucidate such fundamental properties by employing in-situ transmission electron microscopy (TEM) to investigate the wetting, diffusion, intermetallic compound (IMC) formation and its associated interface motion between the nanosolder and functional nanocomponents during the soldering reaction of the nanowires. The Cu-Sn metallurgical soldering reaction in two-segmented Cu-Sn nanowires is visualized in real time using in-situ transmission electron microscopy. By varying the relative lengths of Cu and Sn segments, we show that the metallurgical reaction starts at ~ 200 °C with the formation of a Cu-Sn solid solution for the Sn/Cu length ratio smaller than 1:5 while the formation of Cu-Sn intermetallic compounds (IMC) for larger Sn/Cu length ratios. Upon heating the nanowires up to ~ 500 °C, two phase transformation pathways occur, eta-Cu 6Sn5 → epsilon-Cu3Sn → delta-Cu 41Sn11 for nanowires with a long Cu segment and eta-Cu 6Sn5 → epsilon-Cu3Sn → gamma-Cu 3Sn with a short Cu segment. The dynamic in situ TEM visualization of the evolution of Kirkendall voids demonstrates that Cu diffuses faster both in Sn and IMCs than that of Sn in Cu and IMCs. The dynamic process of the propagation and shape evolution of the Cu6Sn5/Sn and Cu/Cu6Sn5 interfaces is monitored by in-situ transmission electron microscopy during the isothermal intermetallic compound growth. The Cu6Sn5/Sn interface is observed to evolve from an inclined configuration to the vertical, edge-on configuration with the propagation of the Cu6Sn5 phase towards the Sn segment. The Cu/Cu 3Sn interface also becomes less inclined as it propagates towards the Cu segment. This interface evolution is driven by the minimization of the interface energy by minimizing the interface area associated with the edge-on interface. The Kirkendall void growth induces the breakage of the Cu segment and results in the Cu3Sn → Cu6Sn5 transformation with final Sn/Cu6Sn5/void/Cu sandwich structure.
机译：通过选择两段式Cu-Sn纳米线作为模型系统，其中Sn用作焊料元素，Cu用作功能元素，我们寻求通过原位透射电子显微镜（TEM）来阐明这种基本特性。在纳米线的焊接反应过程中，润湿，扩散，金属间化合物（IMC）的形成及其在纳米焊料和功能性纳米组件之间的相关界面运动。使用原位透射电子显微镜实时可视化两段式Cu-Sn纳米线中的Cu-Sn冶金焊接反应。通过改变Cu和Sn链段的相对长度，我们发现冶金反应始于〜200°C，形成的Sn / Cu长度比小于1：5的Cu-Sn固溶体同时形成了Cu。 -Sn金属间化合物（IMC），用于更大的Sn / Cu长度比。将纳米线加热到〜500°C时，发生两条相变路径，即具有长Cu段和eta-Cu 6Sn5的纳米线的eta-Cu 6Sn5→epsilon-Cu3Sn→delta-Cu 41Sn11具有短铜段的3Sn。希尔肯德尔空隙演化的动态原位TEM可视化表明，铜在Sn和IMC中的扩散速度都快于Sn在Cu和IMC中的扩散速度。 Cu6Sn5 / Sn和Cu ​​/ Cu6Sn5界面的传播和形状演变的动态过程通过等温金属间化合物生长过程中的原位透射电子显微镜进行监控。随着Cu6Sn5相向Sn段的传播，观察到Cu6Sn5 / Sn界面从倾斜构型演变为垂直的边沿构型。 Cu / Cu 3Sn界面向Cu段传播时，其倾斜度也较小。通过最小化与边缘接通接口相关联的接口面积，通过最小化接口能量来驱动该接口演进。 Kirkendall空隙的生长引起Cu段的断裂，并导致Cu3Sn→Cu6Sn5转变为最终的Sn / Cu6Sn5 / void / Cu夹心结构。

著录项

  • 作者

    Yin, Qiyue.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Materials science.;Engineering.;Polymer chemistry.
  • 学位 Ph.D.
  • 年度 2017
  • 页码 138 p.
  • 总页数 138
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

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