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Plasma deposition of diamond-like carbon and fluorinated amorphous carbon and the resultant properties and structure.

机译：类金刚石碳和氟化无定形碳的等离子体沉积及其所产生的特性和结构。

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摘要

Researchers first created diamondlike carbon (DLC) 50 years ago, but it has only been the subject of intense research for the last decade. DLC is a highly stressed thin film that exists as a mixture of diamond like sp 3 and graphite like sp2 bonded carbon, with 0–50% H. Many believe that high intrinsic stress states are necessary to stabilize the carbon spa content responsible for the high hardness of DLC.; This author's goals include fabricating high quality fluorinated amorphous carbon (FLAC) films by plasma enhanced chemical vapor deposition (PECVD), exploring the relationships between the processing parameters and the dielectric value, as well as the related material properties which limit the useful application of FLAC. An improved understanding of the fundamentals behind FLAC processing may allow workers to improve upon the properties limiting its use, such as intrinsic stress, thermal stability, and thermal conductivity.; DLC and FLAC film hardness ranged from 14–16 GP and 16–18 GPa respectively. Their film stress ranged from 800 MPa to a 10 GPa. A study of the thickness dependent properties showed that only films thicker than 200 nm were able to achieve stresses greater than approximately 1.6 GPa, the room temperature transition pressure of graphite to diamond. X-ray photoelectron spectroscopy measurements also yielded different C sp3 contents for films of varying thickness deposited under the same conditions, helping to confirm a thickness dependence of film properties greater than 200 nm.; Observation of the stress in real time during annealing of the films on Si wafers yielded activation energy values for the stress relief of DLC and FLAC as 0.11 and 0.24 eV respectively, and the CTE of DLC as 10.6 × 10−6 C−1. The stress relief mechanism consists of kinetically limited network arrangements that occur in highly stressed zones due heating, which are also the cause of the reduction in dielectric constant that occurs during rapid thermal annealing. Thermal conductivity measurements yielded results as high as 0.6Wm−1 K −1.
机译：研究人员于50年前首次创建了类金刚石碳（DLC），但直到最近十年才进行了深入研究。 DLC是一种高应力薄膜，它以金刚石（如sp 3 ）和石墨（如sp 2 键合碳）的混合物形式存在，氢含量为0％至50％。内在应力状态对于稳定导致DLC高硬度的碳温泉含量是必不可少的。作者的目标包括通过等离子体增强化学气相沉积（PECVD）制造高质量的氟化无定形碳（FLAC）膜，探索工艺参数与介电值之间的关系以及相关材料特性，从而限制FLAC的有用应用。更好地理解FLAC处理的基本原理可以使工人改进限制其使用的特性，例如固有应力，热稳定性和导热性。 DLC和FLAC膜的硬度分别为14-16 GP和16-18 GPa。它们的膜应力范围为800 MPa至10 GPa。对厚度相关特性的研究表明，只有厚度大于200 nm的薄膜才能获得大于约1.6 GPa的应力，即石墨向金刚石的室温转变压力。 X射线光电子能谱测量还发现，在相同条件下沉积的不同厚度的薄膜，其Csp 3 含量也不同，这有助于确认薄膜的厚度依赖性大于200 nm。观察硅晶片上薄膜退火过程中的实时应力，DLC和FLAC应力释放的活化能值分别为0.11和0.24 eV，DLC的CTE为10.6×10 -6 C -1 。应力消除机制由受热限制的高应力区域中发生的动力学受限制的网状结构组成，这也是快速热退火过程中介电常数降低的原因。热导率测量得出的结果高达0.6Wm -1 K -1 。

著录项

  • 作者

    Glew, Alexander David.;

  • 作者单位

    Stanford University.;

  • 授予单位 Stanford University.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2003
  • 页码 145 p.
  • 总页数 145
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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