Simple process and low cost are the two major advantages of lead frame package, but the application bandwidth has been limited by its fixed structure. Based on a standard 64-lead low-profile quad flat package, HFSS was used to create optimized package model and simulate for S parameters. The simulation results show that the optimized model has extended the RFIC/MMIC package bandwidth to higher frequencies at lower cost. The bandwidth measured for insertion loss （S31） , return loss （S11） , and coupling （S21） is 4.7GHz （at -1dB） , 4.9GHz （at -15dB） , and 2.7GHz （at -15dB） . Compared with the standard LQFP64 package, we find that the bandwidth of S31, S11, and S21 is increased 34%, 58%, and 69% respectively.%工艺简单、成本低廉是引线框架封装的优点，但引线框架的固定结构限制了其应用带宽。文中利用HFSS软件完成了一种标准的LQFP64引线框架的优化建模和S参数仿真。结果表明，该LQFP64优化模型以较低的封装成本提高了射频／微波集成电路的封装带宽，其回波损耗S31在4．7GHz为-1dB、插入损耗S11在4．9GHz为-15dB、串扰S21在2．7GHz为-15dB，较标准模型分别提高了34％、58％和69％。
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