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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles
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High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles

机译：高温，低模量粘合剂，可在硅和氧化铝砖上进行大面积薄膜加工

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摘要

The fabrication of high-density interconnect structures typically involves sequential processing of alternate layers of thin organic dielectric materials and conducting copper lines. With the continued push toward low-cost fabrication, large-area processing of thin-film materials is being aggressively pursued by the electronic packaging industry. The objective of the ongoing work at Georgia Tech is to develop innovative materials, models, and processing techniques to facilitate large-area processing of alumina and silicon tiles. As the alumina and silicon tiles are commercially available in smaller dimensions, a palletization approach has been developed to facilitate large-area processing. In the palletization approach, alumina and silicon tiles are attached to re-usable glass pallets with an in-house developed thermally-stable, reworkable, and highly-compliant adhesive.
机译：高密度互连结构的制造通常包括依次处理薄有机电介质材料和导电铜线的交替层。随着低成本制造的不断推动，电子包装行业正在积极地进行薄膜材料的大面积加工。佐治亚理工学院正在进行的工作的目的是开发创新的材料，模型和加工技术，以促进氧化铝和硅砖的大面积加工。由于氧化铝和硅砖以较小的尺寸在市场上可以买到，因此已经开发出码垛方法以促进大面积加工。在货盘化方法中，氧化铝和硅砖通过内部开发的热稳定，可返工且高度顺应的粘合剂附着在可重复使用的玻璃货盘上。

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