...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Vacuum Science & Technology >Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
【24h】

Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers

机译：等离子增强原子层沉积生长的RuTaN直接平板势垒上电镀铜的成核和生长特性

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

A study has been carried out to understand the mechanism that enables plasma enhanced atomic layer deposition (PEALD)-grown RuTaN barriers to support direct (seedless) copper electroplating. In particular, the effects of changing the liner surface chemistry on the subsequent plated copper nucleation behavior have been evaluated. Amperometric measurements and short pulse plating experiments were carried out directly on PEALD-grown RuTaN barriers. To enhance copper nucleation, a liner surface cleaning protocol was developed and evaluated. In order to understand the effect of intrinsic liner composition and conductivity on the film microstructure and subsequent plated copper nucleation, a study of copper nucleation density as it relates to the Ru:Ta ratio in the liner was carried out. The thickness extendibility of these direct plate liners was also explored. These liners were also tested for potential use in sub-45-nm copper metallization applications.
机译：已经进行了一项研究以了解使等离子体增强的原子层沉积（PEALD）生长的RuTaN势垒能够支持直接（无核）铜电镀的机理。特别地，已经评估了改变衬里表面化学性质对随后的电镀铜成核行为的影响。直接在PEALD生长的RuTaN势垒上进行安培测量和短脉冲电镀实验。为了增强铜的成核作用，开发并评估了衬里表面清洁方案。为了理解固有衬里组成和导电率对薄膜微结构和随后镀覆的铜成核的影响，进行了铜成核密度的研究，因为铜成核密度与衬里的Ru：Ta比有关。还研究了这些直接板衬的厚度可扩展性。这些衬里还经过测试，可用于低于45 nm的铜金属化应用。

著录项

  • 来源
    《Journal of Vacuum Science & Technology》 |2011年第3期|p.030605.1-030605.8|共8页
  • 作者

    Tonmoy Chakraborty; Daniel Greenslit; Eric T. Eisenbraun;

  • 作者单位

    College of Nanoscale Science and Engineering, University at Albany, State University of New York, 257 Fuller Road, Albany, New York 12203;

    College of Nanoscale Science and Engineering, University at Albany, State University of New York, 257 Fuller Road, Albany, New York 12203;

    College of Nanoscale Science and Engineering, University at Albany, State University of New York, 257 Fuller Road, Albany, New York 12203;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号