...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Micromechanics and Microengineering >Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding
【24h】

Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding

机译：使用低温全晶片胶粘剂制造的新型三维嵌入式SU-8微通道

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This paper describes a novel fabrication method for the manufacture of three-dimensional (3D) interconnected microchannels. The fabrication is based on a full wafer polymer bonding process, using SU-8 polymer epoxy photoresist as a structural material. The technology development includes an improvement of the SU-8 photolithography process in order to produce high uniformity films with good adhesive properties. Hence, 3D embedded microchannels are fabricated by a low temperature adhesive bonding of the SU-8 photopatterned thick films. The bonding occurs at temperatures (100-120 degreesC) lower than those usually applied in bonding technology. The bonding process parameters have been chosen in order to achieve a strong and void-free bond. High bond strengths, up to 8 MPa, have been obtained. Several examples using this new technology are shown, including bonding between different combinations of silicon and Pyrex wafers. This method also allows us to bond wafers with previously surface micromachined structures. Interconnected microchannels with vertical smooth walls and aspect ratios up to five have been obtained. Channels from 40 to 60 mum depth and from 10 to 250 mum width have been achieved. Liquid has been introduced at different levels into the microchannels, verifying good sealing of the 3D interconnected microchannels. The fabrication procedure described in this paper is fast, reproducible, CMOS compatible and easily implementable using standard photolithography and bonding equipment.
机译：本文介绍了一种用于制造三维（3D）互连微通道的新颖制造方法。该制造基于完整的晶圆聚合物键合工艺，使用SU-8聚合物环氧光致抗蚀剂作为结构材料。技术发展包括对SU-8光刻工艺的改进，以生产具有良好粘合性能的高均匀性薄膜。因此，通过SU-8光图案化厚膜的低温粘合剂粘结来制造3D嵌入式微通道。粘合发生在比粘合技术通常使用的温度低的温度（100-120摄氏度）下。选择粘合工艺参数以实现牢固且无空隙的粘合。已获得高达8 MPa的高粘结强度。展示了使用这种新技术的几个例子，包括硅和派热克斯晶片的不同组合之间的结合。这种方法还使我们能够将晶圆与先前的表面微机械结构结合在一起。已经获得了具有垂直光滑壁且纵横比最高为5的互连微通道。已经实现了40至60毫米深度和10至250毫米宽度的通道。液体已以不同的水平引入微通道，从而验证了3D互连微通道的良好密封性。本文中描述的制造过程是快速，可重复的，CMOS兼容的，并且可以使用标准光刻和键合设备轻松实现。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号