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Effects of polysiloxane on thermal conductivity and compressive strength of porous silica ceramics

机译：聚硅氧烷对多孔二氧化硅陶瓷导热率和抗压强度的影响

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摘要

In this paper, we propose a novel processing technique to prepare lightweight porous silica thermal insulators by considering both structural integrity and thermal conductivity. Porous silica ceramics with high thermal insulation performances (0.044-0.085 Wm(-1)K(-1)) and excellent compressive strengths (3.9-14.5 MPa) were fabricated by adding polysiloxane into fumed silica. Fumed silica was selected as the matrix material and further reinforced with polysiloxane-derived silica to enhance the mechanical strength. The addition of 10 wt% of polysiloxane increased the compressive strength (6.8 MPa) of the porous silica ceramic to almost 74% more than that (3.9 MPa) of porous silica without polysiloxane sintered at 600 degrees C, with a minimal increase in thermal conductivity from 0.044 to 0.049 Wm(-1)K(-1). The specific compressive strengths (16.4-21.1 MPa (g/cm(3))(-1)) of the porous silica ceramics fabricated with 20 wt% polysiloxane were remarkably high compared to those (1.0-14.7 MPa (g/cm(3))(-1)) calculated in previous studies.
机译：在本文中，我们提出了一种新的加工技术，通过考虑结构完整性和导热性来制备轻质多孔二氧化硅热绝缘体。具有高保温性能的多孔二氧化硅陶瓷（0.044-0.085WM（-1）k（-1））和优异的压缩强度（3.9-14.5MPa），通过将聚硅氧烷加入熏蒸二氧化硅制备。选择熏蒸二氧化硅作为基质材料，并通过聚硅氧烷衍生的二氧化硅进一步加强，以增强机械强度。添加10wt％的聚硅氧烷将多孔二氧化硅的压缩强度（6.8MPa）增加至多孔二氧化硅的近74％，而在600℃下烧结的聚硅氧烷的多孔二氧化硅的近74％（3.9MPa），导热率最小增加从0.044至0.049 Wm（-1）k（-1）。与20wt％聚硅氧烷制备的多孔二氧化硅陶瓷的比抗压强度（16.4-21.1mPa（g / cm（3））（ - 1））与那些（1.0-14.7mPa（g / cm（3 ））（ - 1））在以前的研究中计算。

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