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首页> 外文期刊>Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe >Chip packaging challenges ... a roadmap based overview
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Chip packaging challenges ... a roadmap based overview

机译：芯片封装挑战...基于路线图的概述

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Purpose - To provide an insight and view of the expected directions for microelectronic packaging, at chip level, that ties in current developments to the needs envisaged by emerging technology roadmaps.Design/methodology/approach - The requirements for packaging semiconductor devices have become a new technology driver for the electronics "Final Manufacturing" industry. In line with forecasts and roadmaps, the expected multitude of options are being developed in order to meet the demand of an industry which requires ever more complex devices which exhibit both higher reliability and lower cost.Findings - As application potentials develop, so package cost becomes the driver. In turn, low cost package solutions are becoming the drivers for new technologies such as "last-mile" fibre optic Telecom systems, 3G phones, bluetooth and sensors. MEMS devices are a key example of how applications are pushing the technologies to create cost effective packaging.Research limitations/implications - The emerging packaging technologies, currently BGA's and chip size packaging's (CSP), continue to develop to meet the needs of electronic devices, driven by the "smaller, faster, cheaper" paradigm, However the final manufacturing and testing aspects of such needs are often overlooked and as such the test industry faces a number of severe challenges in terms of handling these new package technologies.Practical implications - By looking at the market trends and how these new technologies are developing, especially with respect to emerging developments in CSF, flip chip and wafer level packaging, solutions for many of the challenges posed can be determined.Originality/value - This paper provides a market analysis of the trends and directions of the chip packaging industry. It has taken data from a wide number of sources of market information and compared the expectations of each to actual emerging applications. The resulting information is expected to become a benchmark for this aspect of the semiconductor manufacturing industry.
机译：目的-在芯片级别上提供对微电子封装的预期方向的见解和看法，将当前的发展与新兴技术路线图所设想的需求联系在一起。设计/方法/方法-封装半导体器件的要求已成为新的电子“最终制造”行业的技术驱动力。根据预测和路线图，正在开发预期的多种选择，以满足一个行业的需求，该行业需要越来越复杂的设备，这些设备必须具有更高的可靠性和更低的成本。发现-随着应用潜能的发展，封装成本变得越来越高司机。反过来，低成本封装解决方案正成为诸如“最后一英里”光纤电信系统，3G电话，蓝牙和传感器等新技术的驱动力。 MEMS装置是应用程序如何推动技术以创建具有成本效益的封装的一个关键示例。研究局限/含意-新兴的封装技术（目前BGA和芯片尺寸封装（CSP））将继续发展，以满足电子设备的需求，在“更小，更快，更便宜”的范式驱动下，然而，此类需求的最终制造和测试方面常常被忽略，因此，测试行业在处理这些新包装技术方面面临着许多严峻的挑战。着眼于市场趋势以及这些新技术的发展方式，特别是在CSF，倒装芯片和晶圆级封装的新兴发展方面，可以确定所面临的许多挑战的解决方案。原创性/价值-本文提供了市场分析芯片封装行业的趋势和方向。它从众多市场信息源中获取数据，并将每种期望与实际新兴应用进行了比较。预期得到的信息将成为半导体制造业这一方面的基准。

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