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6 nm half-pitch lines and 0.04 mu m(2) static random access memory patterns by nanoimprint lithography

机译:6纳米半间距线和0.04微米(2)静态随机访问存储模式的纳米压印光刻

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摘要

A key issue in nanoimprint lithography (NIL) is determining the ultimate pitch resolution achievable for various pattern shapes and their critical dimensional control. To this end, we demonstrated the fabrication of 6 nm half-pitch gratings and 0.04 mu m(2) cell area SRAM metal interconnects with 20 nm line half-pitch in resist by NIL. The mould for the 6 nm half-pitch grating was fabricated by cleaving a GaAs/Al0.7Ga0.3As superlattice grown on GaAs with molecular beam epitaxy, and selectively etching away the Al0.7Ga0.3As layers in dilute hydrofluoric acid. The mould for the 0.04 mu m(2) SRAM metal interconnects was fabricated in silicon dioxide using 35 kV electron beam lithography with polystyrene as a negative resist and a reactive ion etch with the resist as mask. Imprints from both moulds showed excellent fidelity and critical dimension control.
机译:纳米压印光刻(NIL)的关键问题是确定各种图案形状及其关键尺寸控制可达到的最终间距分辨率。为此,我们通过NIL演示了在抗蚀剂中具有20 nm线半节距的6 nm半节距光栅和0.04μm(2)单元面积SRAM金属互连的制造方法。通过用分子束外延裂解在GaAs上生长的GaAs / Al0.7Ga0.3As超晶格,并在稀氢氟酸中选择性地蚀刻掉Al0.7Ga0.3As层,来制造用于6 nm半间距光栅的模具。用于0.04微米(2)SRAM金属互连的模具是在二氧化硅中使用35 kV电子束光刻技术制造的,其中聚苯乙烯为负抗蚀剂,而反应离子蚀刻为抗蚀剂为掩模。两种模具的印记均显示出出色的保真度和临界尺寸控制。

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