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首页> 外文会议>42nd international symposium on microelectronics (IMAPS 2009) >A Coupling between Electromigration(EM) and Kirkendall Effect in Sn-3.5Ag/Cu Solder Joint
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A Coupling between Electromigration(EM) and Kirkendall Effect in Sn-3.5Ag/Cu Solder Joint

机译：Sn-3.5Ag / Cu焊点中电迁移（EM）与Kirkendall效应的耦合

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摘要

Sn-3.5Ag/Cu solder joints were prepared by reflowing the eutectic solder on the PCB Cu opening whichrnwas electroplated using SPS additive in the bath. Effects of electromigration on the Kirkendall void growth werernexamined by applying electric current during isothermal aging at 150℃,and analyzing SEM micrographs.rnWithout current, Cu_3Sn and Cu_6Sn_5 intermetallic compounds (IMC) formed at the Sn-3.5Ag/Cu interface with arndiffusion controlled mechanism. With electricity, (1×10~4 A/cm~2), kinetics of Kirkendall void and IMC growthrnwere affected, which depend on the direction of the electric current flow. At the anode side, IMC thickness, rnδCu_6Sn_5 increased remarkably, and the same was true of Kirkendall voids localized at the Cu_3Sn/Cu interface.rnOn the other hand, δCu_3Sn and δCu_6Sn_5 were both substantially suppressed at the cathode side. Cu_6Sn_5 showedrna strong susceptibility to the polarity effect, while Cu_3Sn did not. Electromigration force induced additionalrntensile (or compressive) stress at the anode (or cathode), which accelerated (or decelerated) the void growth.
机译：Sn-3.5Ag / Cu焊点是通过在PCB铜开口上回流低共熔焊料来制备的，该开口在镀液中使用SPS添加剂进行电镀。通过在150℃等温时效过程中施加电流，并分析SEM显微镜检查电迁移对Kirkendall空隙生长的影响。在无电流的情况下，通过控制扩散机制在Sn-3.5Ag / Cu界面形成Cu_3Sn和Cu_6Sn_5金属间化合物（IMC）。 。通电时（1×10〜4 A / cm〜2），柯肯达尔空洞的动力学和IMC的生长受到影响，这取决于电流的流动方向。在阳极侧，IMC厚度rnδCu_6Sn_5显着增加，位于Cu_3Sn / Cu界面的Kirkendall空隙也是如此。另一方面，在阴极侧δCu_3Sn和δCu_6Sn_5均被显着抑制。 Cu_6Sn_5对极性效应表现出较强的敏感性，而Cu_3Sn没有。电迁移力在阳极（或阴极）处引起额外的拉伸（或压缩）应力，从而加速（或减速）空隙的生长。

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  • 来源
  • 会议地点 San Jose CA(US);San Jose CA(US)
  • 作者

    H.W. Kang; Jin Yu; Y. Jung;

  • 作者单位

    Center for Electronic Packaging Materials,rnDepartment of Materials Science and Engineering, KAIST, 373-1rnGuseong-dong, Yuseong-gu, Daejeon 305-701, Republic of Korea;

    rnCenter for Electronic Packaging Materials,rnDepartment of Materials Science and Engineering, KAIST, 373-1rnGuseong-dong, Yuseong-gu, Daejeon 305-701, Republic of KorearnPhone: +82-42-350-4274 Fax: +82-42-350-8841 E-mail: jinyu@kaist.ac.kr;

    rnCenter for Electronic Packaging Materials,rnDepartment of Materials Science and Engineering, KAIST, 373-1rnGuseong-dong, Yuseong-gu, Daejeon 305-701, Republic of Korea;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路（IC）;
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