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首页> 外文会议>2019 Electron Devices Technology and Manufacturing Conference >Samung Fan-out Panel Level Package Solutions
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Samung Fan-out Panel Level Package Solutions

机译：三星扇出面板级封装解决方案

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摘要

As the industry moves Beyond Moore, there has been much efforts for the next-generation of packaging, among which Fan-out wafer-level-package is getting significant attention with its high-degree heterogeneous integration capability, small form-factor. As fan-out package steps on mass production stage, Panel level package (PLP) is emerging as the most cost-effective solution featuring a large and efficient working area for a varied unit size and array, while commercialization of PLP needs to address some of significant technical challenges in particular by facing RDL formation with fine pitch pattern for specific applications. Here, we introduce various PLP solutions including discrete, PoP, module and 2.5D RDL-interposer. Finally, we explain the PLP development status and the next generation platforms in the future.
机译：随着行业超越摩尔定律，下一代封装已经付出了很多努力，其中扇出晶圆级封装因其高度的异质集成能力，小尺寸而受到了广泛的关注。随着扇出式包装进入批量生产阶段，面板级包装（PLP）成为最具成本效益的解决方案，具有适用于各种尺寸和阵列的大而有效的工作区域，而PLP的商业化需要解决一些特别是面对具有特定应用场合的细间距图案的RDL形成，这是重大的技术挑战。在这里，我们介绍各种PLP解决方案，包括离散，PoP，模块和2.5D RDL插入器。最后，我们解释了PLP的发展状况和未来的下一代平台。

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