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Transistor Leakage Components Effect of Leakage on VCO performance

机译:晶体管泄漏成分及泄漏对VCO性能的影响

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In the past 10 years, CMOS technology scaling has continued at the rate of every 1 陆 to 2 years per node. As CMOS technology advanced in to nano technology regime, static power or standby power increases at a much faster rate than dynamic power or active power, and it is expected to dominate the total device power dissipation. In this paper, we will review major leakage components that contributed to the significant rises in standby power and show the relationship between gate leakage and VCO performance. The results clearly show that the projected leakage at the 45nm node for advanced transistors will result in VCO performance that will not meet the stringent requirements for 3G solutions and beyond unless additional noise reduction techniques are utilized.
机译:在过去的10年中,CMOS技术的扩展以每节点1到2年的速度持续发展。随着CMOS技术发展到纳米技术领域,静态功率或待机功率的增长速度比动态功率或有功功率的增长速度快得多,并且预计它将占整个设备功耗的主导地位。在本文中,我们将回顾造成待机功耗显着提高的主要泄漏成分,并说明栅极泄漏与VCO性能之间的关系。结果清楚地表明,高级晶体管在45nm节点处的预计泄漏将导致VCO性能无法满足3G解决方案的严格要求,除非使用其他降噪技术。

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