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首页> 外文会议>ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems >DESIGN GUIDELINE TO IMPROVE THERMAL MANAGEMENT OF 3D PACKAGE USING CU-TO-CU DIRECT BONDING
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DESIGN GUIDELINE TO IMPROVE THERMAL MANAGEMENT OF 3D PACKAGE USING CU-TO-CU DIRECT BONDING

机译：使用CU-CU直接键合改善3D封装热管理的设计指南

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摘要

Three-dimensional (3D) packaging technology is directly related to the increasing I/O number as stacking chips. This technology has the potential to produce integrated circuits with a much better combination of cost, functionality, performance and power consumption. However, stacked chips raise several thermal issues that need to be addressed and eliminated. In this study, a quantitative study of the conventional solder-based interconnection is conducted based on many different cases of thermal loading, using finite element analysis (FEA). This preliminary study clearly shows limitation of the solder-based interconnection in the thermal management perspective. Underfill for microbump acts as a barrier of heat transfer in the conventional 3D stacked chip packages. Therefore, as an alternative, Cu-to-Cu direct bonding (CuDB), which has a better thermal conductivity, is proposed. Its parametric study is performed under the same/different loading conditions and dimensions. This study helps to highlight the thermal behavior of 3D packages consisting of various interconnections. Finally, based on the results, we can propose qualitative design guidelines of 3D packaging depending on various environment and conditions.
机译：三维（3D）包装技术与堆叠芯片的增加的I / O编号直接相关。该技术有可能生产成本，功能，性能和功耗的更好组合。但是，堆叠芯片抬起了几个需要解决和消除的热问题。在该研究中，使用有限元分析（FEA），基于许多不同的热负荷情况进行了对常规焊料的互连的定量研究。该初步研究清楚地示出了热管理视角下基于焊料的互连的限制。 Microbump的底部填充剂作为传统3D堆叠芯片封装中的传热屏障。因此，提出了作为替代，提出具有更好的导热性的Cu-〜-Cu直接粘合（CUDB）。其参数学研究是在相同/不同的负载条件和尺寸下进行的。该研究有助于突出由各种互连组成的3D包的热行为。最后，根据结果，我们可以根据各种环境和条件提出3D包装的定性设计指南。

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