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Heat Conduction in Three Dimensional Stacked Packages

机译：三维堆叠包装中的热传导

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摘要

This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of such domains may be considered in the current study. The thermal conductivity and thickness of these domains may be different. The entire geometry composed of these connected domains is considered as adiabatic on the lateral surfaces and can be subjected to uniform convective cooling at one end. The other end of the geometry may be adiabatic and a specified, spatially varying heat generation rate can be applied in each of the domains. The solutions are found to be in agreement with known solutions for simpler geometries. The analytical solution presented here is very general in that it takes into account the interface resistances between the layers. One application of this analytical study relates to the thermal management of a 3-D stack of devices and interconnect layers. Another possible application is to the study of hotspots in a chip stack with non uniform heat generation. Many other potential applications may also be simulated.
机译：本文介绍了多个矩形域中稳态导热的分析研究的结果。目前的研究中可以考虑任何有限数量的此类领域。这些域的导热率和厚度可能是不同的。由这些连接结构域组成的整个几何形状被认为是横向表面的绝热，并且可以在一端进行均匀的对流冷却。几何形状的另一端可以是绝热的，并且可以在每个域中应用指定的空间变化的发热速率。发现解决方案与更简单的几何形状的已知解决方案一致。这里提出的分析解决方案非常一般，因为它考虑了层之间的界面电阻。该分析研究的一个应用涉及3-D堆叠设备和互连层的热管理。另一个可能的应用是在具有非均匀发热的芯片堆中研究热点。还可以模拟许多其他潜在应用。

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