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首页> 外文会议>Conference on Metrology, Inspection, and Process Control for Microlithography >Optimization of an Integrated and Automated Macro Inspection System for the Utilization of Wafer Color Variation Detection in a Photolithography Cluster
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Optimization of an Integrated and Automated Macro Inspection System for the Utilization of Wafer Color Variation Detection in a Photolithography Cluster

机译：用于在光刻簇中利用晶片颜色变化检测的集成和自动宏观检查系统的优化

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The IBM 300 mm wafer manufacturing line provides a case study for the optimization of an automated macro defect inspection system to accurately flag global wafer color variation. The IBM inspection system was falsely flagging a large number of wafers primarily for global wafer color variation, leading to unacceptable amounts of production volume being placed on hold. A review of the macro inspection system identified several areas for improvement. An investigation into the installed hardware base found a panel behind the beam splitter was introducing noise through reflected light. This panel was replaced with a less reflective material. A review of the failed wafers found that maximum light levels were not achieved across all tools and an improved diffuser plate for the fiber optic output was designed to improve light transmittance. Global wafer color is determined by comparing the scanned wafer image to a "golden" data set, referred to as a "color baselist," which is composed of data from 30 wafers. A review of the recipe baselists revealed that some of the wafer samples did not accurately represent process conditions, and new wafer samples were collected. Finally, a tool-to-tool matching test revealed that the set of weightings given to each of the color parameters in the baselists was not optimized. After implementing the above changes, false global wafer color failures were virtually eliminated.
机译：IBM 300mm晶片制造线提供了用于优化自动宏观缺陷检查系统以准确标志的全局晶片颜色变化的案例研究。 IBM检测系统主要伪造大量晶片，主要用于全局晶圆色变化，导致持有的生产量不可接受。宏观检查系统的审查确定了几个改进领域。对已安装的硬件基座的调查发现，分束器后面的面板通过反射光引入噪声。使用较少的反射材料代替该面板。对失败的晶片的审查发现，所有工具中未实现最大光线，并且设计用于光纤输出的改进的扩散板以改善透光率。通过将扫描的晶片图像与“Golden”数据集进行比较，通过将扫描的晶片图像与“彩色基座”（Color Baselist）进行比较来确定全局晶片颜色，其由来自30个晶片的数据组成。对食谱基座的审查显示，一些晶片样品没有准确地表示工艺条件，并收集新的晶片样品。最后，刀具到刀具匹配测试显示，未优化给出给基板家中的每个颜色参数的加权集。实施上述更改后，实际上消除了虚假的全局晶片颜色故障。

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