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首页> 外文会议>Metrology, Inspection, and Process Control for Microlithography XX pt.2 >Optimization of an Integrated and Automated Macro Inspection System for the Utilization of Wafer Color Variation Detection in a Photolithography Cluster
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Optimization of an Integrated and Automated Macro Inspection System for the Utilization of Wafer Color Variation Detection in a Photolithography Cluster

机译：利用光刻集群中晶片色差检测的集成自动宏观检测系统的优化

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The IBM 300 mm wafer manufacturing line provides a case study for the optimization of an automated macro defect inspection system to accurately flag global wafer color variation. The IBM inspection system was falsely flagging a large number of wafers primarily for global wafer color variation, leading to unacceptable amounts of production volume being placed on hold. A review of the macro inspection system identified several areas for improvement. An investigation into the installed hardware base found a panel behind the beam splitter was introducing noise through reflected light. This panel was replaced with a less reflective material. A review of the failed wafers found that maximum light levels were not achieved across all tools and an improved diffuser plate for the fiber optic output was designed to improve light transmittance. Global wafer color is determined by comparing the scanned wafer image to a "golden" data set, referred to as a "color baselist," which is composed of data from 30 wafers. A review of the recipe baselists revealed that some of the wafer samples did not accurately represent process conditions, and new wafer samples were collected. Finally, a tool-to-tool matching test revealed that the set of weightings given to each of the color parameters in the baselists was not optimized. After implementing the above changes, false global wafer color failures were virtually eliminated.
机译：IBM 300毫米晶圆生产线提供了一个案例研究，用于优化自动宏观缺陷检测系统以准确标记全局晶圆颜色变化。 IBM检查系统错误地标记了大量的晶圆，主要是为了改变整体晶圆的颜色，从而导致无法接受的生产量被搁置。对宏观检查系统的审查确定了有待改进的几个方面。对已安装的硬件基座进行的调查发现，分束器后面的面板正在通过反射光引入噪声。该面板由反射率较低的材料代替。对失效晶圆的检查发现，在所有工具上均未达到最大光水平，并且针对光纤输出设计了改进的扩散板，以提高透光率。通过将扫描的晶圆图像与“金色”数据集（称为“颜色基本列表”）进行比较来确定总体晶圆颜色，该数据集由来自30个晶圆的数据组成。对配方基本列表的审查显示，某些晶圆样品不能准确代表工艺条件，因此收集了新的晶圆样品。最后，工具对工具的匹配测试表明，未优化基列表中赋予每个颜色参数的权重集。实施上述更改后，几乎消除了错误的整体晶圆颜色故障。

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