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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >Fatigue and Bridging Study of High-Aspect-Ratio Multicopper - Column Flip-Chip Interconnects Through Solder Joint Shape Modeling
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Fatigue and Bridging Study of High-Aspect-Ratio Multicopper - Column Flip-Chip Interconnects Through Solder Joint Shape Modeling

机译：高纵横比多铜柱倒装芯片互连的疲劳和桥接研究，通过焊点形状建模

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摘要

This paper addresses fatigue and bridging issues by numerical analysis for an ultra-fine-pitch flip-chip interconnect that consists of multiple copper columns (MCC) and a solder joint. First, the processing flow is briefly presented, which enables prototyping of high-aspect-ratio (～6) copper columns, and hence, enhanced thermomechanical reliability of the interconnects. A public software, Surface Evolver (SE), has been used through this work to predict the solder joint geometry evolution. By integrating SE solder joint shape modeling, stress/strain analysis within ANSYS, and design of experiment (DoE) techniques as well, detailed numerical analysis has been conducted on the solder joint fatigue response to various factors such as the Cu-Solder wetting angle, loading direction, and solder geometry parameters. Finally, by applying the DoE techniques and the most updated features of SE, bridging risks of this interconnect with a fine pitch of 40 μm is investigated, in which critical solder volume is calculated as a function of the interconnect geometry parameters. Based on these results, a solid basis for the design and processing of this advanced flip-chip interconnect has been established.
机译：本文通过对由多个铜柱（MCC）和焊点组成的超细间距倒装芯片互连的数值分析，解决了疲劳和桥接问题。首先，简要介绍了处理流程，该流程可实现高纵横比（〜6）铜柱的原型设计，并因此提高了互连的热机械可靠性。通过这项工作，使用了公共软件Surface Evolver（SE）来预测焊点几何形状的演变。通过将SE焊点形状建模，ANSYS中的应力/应变分析以及实验（DoE）技术集成在一起，已对各种因素（例如Cu-Solder润湿角，加载方向和焊料几何参数。最后，通过应用DoE技术和SE的最新功能，研究了这种间距为40μm的互连的桥接风险，其中根据互连几何参数计算了关键焊料量。基于这些结果，已经为这种先进的倒装芯片互连设计和处理奠定了坚实的基础。

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