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Advanced underfill for high thermal reliability

机译：先进的底部填充技术，具有很高的热可靠性

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The key to the success of flip-chip technology lies in the availability of sucessful underfill materials. However, the reliability of flip-chip technology using current underfill materials is generally found to be lower than that of conventional wire-bond connection packaging materials such as epoxy molding compound (EMC) because of the high coefficients of thermal expansion (CTE) and moisture absorption of cured underfill material. In this study desbimide (DBMI), which has a low melting point (about 80degreesC), was used in the underfill materials as a cohardener. As a result, DBMI-added underfill can show excellent thermal reliability, which is due to the superior properties of the CTE, the elastic modulus, and water resistance. When the properties of a 2 wt % DBMI-added underfill were compared with those of a typical underfill (epoxy/anhydride), the CTE value was reduced to less than one-half at the solder reflow temperature (about 200degreesC), the elastic modulus was reduced to less than one-half in the temperature region below the glass-transition temperature, and the water resistance was improved twofold. (C) 2002 John Wiley Sons, Inc. [References: 11]
机译：倒装芯片技术成功的关键在于成功的底部填充材料的可用性。但是，由于热膨胀系数（CTE）和水分较高，通常发现使用当前底部填充材料的倒装芯片技术的可靠性要低于传统的引线键合连接包装材料，例如环氧模塑化合物（EMC）。吸收固化的底部填充材料。在这项研究中，低熔点（约80摄氏度）的Debimide（DBMI）被用作底部填充材料中的辅助硬化剂。结果，由于CTE的优异性能，弹性模量和耐水性，添加DBMI的底部填充材料可显示出出色的热可靠性。当将添加了2 wt％DBMI的底部填充胶的性能与典型的底部填充胶（环氧树脂/酸酐）的性能进行比较时，在回流焊温度（约200摄氏度）下，CTE值降至不到一半，弹性模量在低于玻璃化转变温度的温度范围内将其降低到不到一半，并且将耐水性提高了两倍。 （C）2002 John Wiley Sons，Inc. [参考：11]

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