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Optical interconnects for system in package by MEMS technology

机译：MEMS技术实现系统级封装的光学互连

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This dissertation presents a novel prototype optical interconnect system achieved by MEMS technology for stacked silicon dies. The overall approach is drawn from concepts on 3D-TSV metal interconnect and introducing an optical interconnect. Optical interconnect is a promising solution for future global interconnect inside a chip package consisting of a stack of multiple dies. The design allows an optical beam to propagate both in plane and out-of-plane, hence establishing optical communication between stacked dies.The entire system includes a pair of 45 micromirrors with one in an upward-facing (front) position and the other in downward-facing (rear) position. Fiber grooves were fabricated on each dies for the purpose of optical testing. Passive alignment structures have been integrated in the system to achieve accurate horizontal alignment. The research work have also proposed a planar silica graded index lens integrated 3D optical interconnect system. A pair of planar silica graded index lens is designed to sit in front of the 45 micromirror pair to mitigate the free space propagation loss. Optical beam free space spot sizes from these planar lenses are commensurate with the micromirror dimensions.To fabricate high quality ultra-smooth 45 micromirror on the (100) monocrystalline silicon surface by anisotropic wet etching, surfactant added TMAH etching behavior was first investigated. Non-ionic surfactants NCW-601A, Triton X-100, NCW-1002 with both high concentration (25%) and low concentration (10%) TMAH solutions was extensively studied for their etching properties on (100) and (110) silicon surfaces. Etch rate, selectivity and surface roughness were studied. Etchant temperature was also varied from 60C to 90C to see the effects on etching behaviour. This research is the first reported use of a new surfactant NCW-1002 in low concentration TMAH. Better selectivity and surface roughness of the (110) plane (i.e. micromirror surface) can be achieved with this surfactant added low concentration TMAH at 60C.In view of the intrinsic partial isotropic etching behavior in the vicinity of the (100) plane for low concentration TMAH with high concentration surfactant, this work has established and demonstrated for the first time in published literature that only a limited portion of the micromirror is truly 45 and is located approximately at the middle of the slope. To reduce the top curved portion, two new techniques have been developed. One technique involves timed HF dip treatments during the etching process to remove the overhanging oxide, which has impeded the etching at the top part of the slope due to the diffusion-dependant effect. The other technique involves a maskless etching. The entire top curved slope can thus be straightened out. To avoid the bottom curved portion, another technique was developed to allow a deeper etch at the lower end of the micromirror to recess the non-45 lower portion of the slope. Both these techniques can nearly double the size of the truly 45 portion of the micromirror. Based on the framework of a front upward-facing 45 micromirror, a processing technique was developed to fabricate a novel rear downward-facing 45 micromirror using electro-chemical TMAH release. With the assistance of passive alignment structures, optical test was conducted to confirm successful optical interconnect between stacked dies using optical fiber. The loss was measured to be 14.7dB, among which free space transmission loss is approximately 10dB. To reduce the free space propagation loss, a pair of planar silica graded index lens integrated optical interconnect system was then proposed. Fabrication of the planar silica graded index lens with front 45 micromirror is confirmed in this research work.
机译：本文提出了一种通过MEMS技术实现的用于堆叠硅芯片的新型光学互连原型系统。总体方法来自3D-TSV金属互连的概念，并引入了光学互连。对于由多个管芯堆叠组成的芯片封装内部的未来全球互连，光互连是一种有前途的解决方案。该设计允许光束在平面内和平面外传播，从而在堆叠的芯片之间建立光通信。整个系统包括一对45 of微镜，其中一个朝上（正面），另一个朝上朝下（后）位置。为了进行光学测试，在每个模具上都制作了光纤凹槽。无源对准结构已集成到系统中，以实现精确的水平对准。研究工作还提出了一种平面二氧化硅渐变折射率透镜集成3D光学互连系统。在45微镜对的前面设计了一对平面二氧化硅渐变折射率透镜，以减轻自由空间传播损失。这些平面透镜的光束自由空间光斑尺寸与微镜尺寸相对应。为了通过各向异性湿法刻蚀在（100）单晶硅表面上制造高质量的超光滑45微镜，首先研究了添加表面活性剂TMAH的刻蚀行为。高浓度（25％）和低浓度（10％）TMAH溶液的非离子表面活性剂NCW-601A，Triton X-100，NCW-1002已针对其在（100）和（110）硅上的蚀刻性能进行了广泛研究表面。研究了蚀刻速率，选择性和表面粗糙度。蚀刻温度也从60°C到90°C不等，以观察其对蚀刻性能的影响。这项研究是首次报道在低浓度TMAH中使用新型表面活性剂NCW-1002。通过在60C下添加低浓度的TMAH，可以在（110）平面（即微镜表面）上实现更好的选择性和表面粗糙度。鉴于在（100）平面附近的固有局部各向同性刻蚀行为在低浓度TMAH和高浓度表面活性剂的作用下，这项工作首次在公开文献中建立并证明，微镜只有有限的一部分确实是45，大约位于斜坡的中间。为了减少顶部弯曲部分，已经开发了两种新技术。一种技术涉及在蚀刻过程中进行定时的HF浸蚀处理，以去除突出的氧化物，由于扩散依赖性效应，该氧化物已阻碍了在斜率顶部的蚀刻。另一种技术涉及无掩模蚀刻。因此，整个顶部弯曲的斜面可以被拉直。为了避免底部弯曲部分，开发了另一种技术，以允许在微镜的下端进行更深的蚀刻，以使倾斜的非45下部凹陷。这两种技术都可以使微镜真正的45部分的尺寸几乎翻倍。基于前部朝下的45°微镜的框架，开发了一种处理技术，可通过电化学TMAH释放来制造新颖的后部朝下的45°微镜。借助无源对准结构，进行了光学测试，以确认使用光纤的堆叠模具之间的成功光学互连。测得的损耗为14.7dB，其中自由空间传输损耗约为10dB。为了减少自由空间的传播损耗，然后提出了一对平面二氧化硅渐变折射率透镜集成光学互连系统。这项研究工作证实了可以制造带有正面45微镜的平面二氧化硅渐变折射率透镜。

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