LOW-DIELECTRIC CONSTANT DIELECTRIC AND COPPER INTERCONNECT STRUCTURE AND INTEGRATION METHOD THEREOF

• 1. 一种低介电常数介质刻蚀与铜互连的结构及集成方法 [P] . 中国专利： CN104269395A . 2015-01-07
• 2. 一种低介电常数介质与铜互连的结构及其集成方法 [P] . 中国专利： CN101982879A . 2011-03-02
• 3. Structure for interconnecting copper with low dielectric constant medium and the integration method thereof [P] . 美国专利： US9070689B2 . 2015-06-30

  机译： 铜与低介电常数介质的互连结构及其集成方法

• 4. STRUCTURE FOR INTERCONNECTING COPPER WITH LOW DIELECTRIC CONSTANT MEDIUM AND THE INTEGRATION METHOD THEREOF [P] . 美国专利： US2013187278A1 . 2013-07-25

  机译： 铜与低介电常数介质的互连结构及其集成方法

• 5. Method and apparatus for integrating low dielectric constant materials into a multilevel metallization and interconnect structure [P] . 美国专利： US6054380A . 2000-04-25

  机译： 将低介电常数材料集成到多层金属化和互连结构中的方法和设备

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