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首页> 外文会议>2016 IEEE 37th International Electronics Manufacturing Technology amp; 18th Electronics Materials and Packaging Conference >Influence of stress on the electromigration life of solder
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Influence of stress on the electromigration life of solder

机译：应力对焊料电迁移寿命的影响

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摘要

It was suggested that electromigration (EM) life of solder can be improved by proper choice of stress property (compressive or tensile) at the two corners where electron current enter and exit. In this paper, we investigated this problem systematically by experiment and finite element simulation. The experimental results show that, compared with the case of tensile stress, the meantime to failure (MTTF) of solder will be slightly longer if the stress at the current entrance and exit are compressive. The finite elemental simulation results show that the arising rate of vacancy density at cathode corner will be the lowest if the stress here is compressive and the stress at anode corner is tensile, and the reverse is the worst case, while the other two cases as we verified in the experiment are intermediate. But in general, the differences in arising rate of vacancy density at cathode corner of solder and thus the influence of stress on electromigration life of solders are not obvious.
机译：建议通过适当选择在电子电流进入和离开的两个角处的应力特性（压缩或拉伸），可以改善焊料的电迁移（EM）寿命。在本文中，我们通过实验和有限元模拟系统地研究了这个问题。实验结果表明，与拉应力情况相比，如果电流入口和出口处的压力处于压缩状态，则焊料的平均失效时间（MTTF）会稍长一些。有限元模拟结果表明，如果此处的应力为压缩应力而阳极角的应力为拉力，则阴极角处空位密度的出现率最低，反之则为最差情况，而其他两种情况在实验中验证是中间的。但是通常，在焊料的阴极角处空位密度的产生速率的差异以及因此应力对焊料的电迁移寿命的影响并不明显。

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