Eliminating Solvents and Acids in Wafer Processing

机译：在晶圆加工中消除溶剂和酸

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A new dry plasma ENVIRO~(TM) process methodology has been developed for solubilizing photoresist-ashing residues after plasma etching or ion implantation. RIE and microwave downstream plasma treatment with NF_3, 0_2 and other gases are employed. 100% solubilization in dI water has been attained with no use of solvent or acids.

机译：已经开发了一种新的干法等离子体ENVIROTM工艺方法，用于溶解等离子体蚀刻或离子注入后的光刻胶灰化残留物。采用RIE和NF_3、0_2和其他气体的微波下游等离子体处理。在不使用溶剂或酸的情况下，已在去离子水中实现了100％的增溶。

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《Conference on Green Engineering, null》||p.29-41|共13页
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Richard L. Bersin;
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ULVAC Technologies, Inc., 401 Griffin Brook Drive, Methuen, MA 01844;

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正文语种 eng
中图分类环境保护管理;
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Eliminating Solvents and Acids in Wafer Processing

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