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Effects of Different Die and Epoxy Thickness to the QFN Package

机译：芯片和环氧树脂厚度对QFN封装的影响

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摘要

Quad Flat No-Lead or QFN is able to provide lighter, thinner and higher performance packaging requirement with its exposed pad and leads at the package bottom for better heat dissipation. However, QFN packages possess certain weaknesses. QFN package failures are related to crack and delaminating, such as die cracking, moulding compound and solder mask interfacial delaminating. From previous projects, the epoxy thickness and die thickness plays an important role in reducing failures in QFN package. The objective of this project is to observe the effects of die and epoxy thickness. The effects on QFN are measured in the die and lead frame part. Stress towards the die is also measured: including thermal, first principle and Von Misses stress. The structural optimization is based on the Finite Element Analysis (FEA). By using ANSYS 10.0, six models were constructed, where three models were built to analyse in thickness of epoxy, and another three to study the effects on die thickness. The effect was measured by the value stress (first principle stress and Von Misses stress) and thermal strain effect, which will lead to a result of how the dimensions of the packaging will give a better tolerance towards stress.
机译：Quad Flat No-Lead或QFN能够通过其裸露焊盘和位于封装底部的引线来提供更轻，更薄，更高性能的封装要求，以实现更好的散热。但是，QFN封装具有某些弱点。 QFN封装故障与裂纹和分层有关，例如管芯破裂，模塑料和阻焊层界面分层。在以前的项目中，环氧树脂厚度和管芯厚度在减少QFN封装中的故障方面起着重要作用。该项目的目的是观察模具和环氧树脂厚度的影响。对QFN的影响是在管芯和引线框架部件中测量的。还测量了对模具的应力：包括热应力，第一原理和Von Misses应力。结构优化基于有限元分析（FEA）。通过使用ANSYS 10.0，构建了六个模型，其中三个模型用于分析环氧树脂的厚度，另外三个模型用于研究对模具厚度的影响。通过值应力（第一主应力和Von Misses应力）和热应变效应来衡量效果，这将导致包装尺寸如何更好地承受压力。

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