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首页> 外文会议>MEMS/MOEMS Technologies and Applications II >The Deflection and Frequency Analysis of the Inhomogeneous Silicon Cantilever Beam for Micro-relay
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The Deflection and Frequency Analysis of the Inhomogeneous Silicon Cantilever Beam for Micro-relay

机译：微继电器非均质硅悬臂梁的挠度和频率分析

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摘要

The inhomogeneous silicon cantilever beam is used to the design of micro-relay, compared the properties with the inhomogeneous and homogeneous cantilever beam, we get the results as: the inhomogeneous cantilever beam has a lower drive power than that of homogeneous; when the same drive power, the pressure of the touch point of the inhomogeneous cantilever is greater than that of homogeneous, but the frequency of the inhomogeneous cantilever is lower than that of homogeneous. In some special cases, if the frequency and dynamic response does not require high precision, the inhomogeneous cantilever beam is a good choice; it can obtain a low driver power and high pressure on the touch point for the micro-relay. The deflection of and the frequency of the analysis of the inhomogeneous silicon cantilever beam for micro-relay is put forward in the paper.
机译：将非均质硅悬臂梁用于微继电器的设计，与非均质，均质悬臂梁相比，其性能为：非均质悬臂梁的驱动力低于均质悬臂梁。当相同的驱动功率时，非均匀悬臂的接触点压力大于均匀悬臂的接触点压力，但是非均匀悬臂的接触频率小于均匀悬臂的接触点压力。在某些特殊情况下，如果不需要高精度的频率和动态响应，则不均匀的悬臂梁是一个不错的选择。它可以在微型继电器的触点上获得较低的驱动器功率和较高的压力。提出了微继电器非均质硅悬臂梁的挠度和分析频率。

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