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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability
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Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability

机译：铜焊盘表面成分与非流动底部填充助焊剂性能关系的研究

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The purpose of this paper is to investigate the effect of copper pad surface composition on the wetting of solder bumps during reflow process for a certain no-flow underfill material. A purchased copper foil which is laminated on FR4 board is used as a control surface. Six different procedures are followed to prepare the surface of the copper foil with six different compositions. XPS is then used to analyze the surface compositions of the six surfaces and the control surface. An in-house developed G25 no-flow underfill encapsulant is used to examine the wetting status of eutectic solder balls on these copper surfaces. The correlation of the copper surface compositions with the solder wetting is then established. It is verified that the compositions of the copper foil surfaces strongly depend on the cleaning procedures. For G25 no-flow underfill material, copper oxide (CuO) is the main composition that prevents the solder ball from wetting the copper foils while the observed organic contamination does not have noticeable effect on the solder wetting.
机译：本文的目的是研究某些无流动底部填充材料在回流过程中铜焊盘表面成分对焊料凸点润湿的影响。将购买的层压在FR4板上的铜箔用作控制面。遵循六种不同程序来制备具有六种不同组成的铜箔表面。然后使用XPS分析六个表面和控制表面的表面成分。内部开发的G25无流动底部填充胶用于检查这些铜表面上共晶焊球的润湿状态。然后建立铜表面成分与焊料润湿的相关性。证实铜箔表面的组成强烈取决于清洁程序。对于G25不流动的底部填充材料，氧化铜（CuO）是防止焊料球润湿铜箔的主要成分，同时观察到的有机污染物对焊料的润湿没有明显的影响。

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