• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Materials Characterization >Electroplating of low stress permalloy for MEMS
【24h】

Electroplating of low stress permalloy for MEMS

机译：用于MEMS的低应力坡莫合金的电镀

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

With the wafer-bending method and spectrophotometry, the internal stress in electroplated Ni-Fe alloy for MEMS has been investigated as a function of bath concentration. This investigation demonstrated that low concentration plating solution is useful for the decrease of the residual stress in the electrodeposits, and the stress could further decrease with an increase of saccharin additive content. And the change of stress from tensile to compressive was not observed with the increase of the additive content in plating path. The low stress permalloy (Ni_(81)Fe_(19)) was reached in our experimental conditions. A bistable electromagnetic RF MEMS switch with deformation-free bilayer cantilever beam was fabricated successfully by electroplated permalloy.
机译：利用晶片弯曲方法和分光光度法，研究了电镀镍-铁合金用于MEMS的内部应力与镀液浓度的关系。该研究表明低浓度的电镀液可用于降低电沉积中的残余应力，并且随着糖精添加剂含量的增加，应力可能会进一步降低。随着电镀路径中添加剂含量的增加，没有观察到应力从拉伸到压缩的变化。在我们的实验条件下达到了低应力坡莫合金（Ni_（81）Fe_（19））。通过电镀坡莫合金成功地制造了具有无变形双层悬臂梁的双稳态电磁RF MEMS开关。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号