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Three-dimensional Macropore Arrays in p-type Silicon Fabricated by Electrochemical Etching

机译:电化学刻蚀制备p型硅中的三维大孔阵列

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Ordered macropores formed in p-type silicon substrates (1.0 similar to 20 Omega.cm) by using electrochemical anodization in various HF-containing electrolytes was investigated under different operating conditions. The effect of electrolyte composition and etch pits or) controlling the formation of macropores on periodically arranged pores is reported. The results revealed that the natures of the constituents of the Solution play very important roles in determining pore formation and morphology and that stable ordered macropore growth is not possible without an inverse pyramid notch. By using a Si/SiGe/Si/SiGe/p-type silicon structure, we were able to fabricate ordered pillar structures without an etch pit formation process. A possible role of two sets of Si/SiGe layers in pillar formation is proposed.
机译:在不同的操作条件下,通过在各种含HF的电解质中进行电化学阳极氧化,研究了在p型硅衬底(1.0类似于20Ω.cm)中形成的有序大孔。报道了电解质成分和蚀刻坑的影响,或控制周期性排列的孔上大孔形成的影响。结果表明,溶液成分的性质在确定孔的形成和形态方面起着非常重要的作用,如果没有反金字塔的缺口,稳定的有序大孔生长是不可能的。通过使用Si / SiGe / Si / SiGe / p型硅结构,我们能够在不进行刻蚀坑形成工艺的情况下制造有序的柱状结构。提出了两组Si / SiGe层在柱形成中的可能作用。

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